ATOP Ashtray Multi Arc Magnetron Sputtering Vacuum Coating Machine

 
Structure type:Vertical type or horizontal type
 
Chamber type:single door or double doors
 
 

1. Magnetron sputtering principle is based on the theory of the cathode glow discharge, it expend the
cathode surface magnetic field near the work piece surface. Then it improves the sputtered atom
ionization rate. It keeps the magnetron sputtering uniformity, also can improve the surface shining effect.
 
2. The arc plasma evaporation source is reliable, it can work under 40A current in optimizing the cathode
and the magnetic field structure,. It will happen atomic diffusion between the coating and the material. It
also has the advantages that lon Beam Assisted Deposition.
 
3. Vacuum pumping system, electric control system and complete vacuum coating system can be
customized according to user requirements.
 
 
4. It equipments cryogenic ion secondary source, some substrate without heating the material, It can
 
directly do the cold plating film at room temperature, save energy, increase productivity.
 
 
5. The maximum of the temperature for tool coating chamber can 600 degrees, In addition to the tool
 
Coater coating applications require heating device, other applications do not need the device.
 
 
 

 
 
Magnetron sputtering working principle of vacuum coating machine, the so-called "splash", under the
 
action of the electrons in an electric field accelerates to the substrate in the process of collision with argon
 
atoms, ionization out large amounts of argon ions and electrons.The electron flies toward the substrate,
 
the argon ion speeds up the target material under the action of the electric field, sputtering out a large
 
number of target atom, and the neutral target atom (or molecule) is deposited on the substrate to form the
 
film.Secondary electron in accelerating to fly to the substrate by magnetic field in the process of lorentz
 
magnetic force, the influence of confined area near the target surface plasma, the plasma density in the
 
area is very high, secondary electron under the action of magnetic field around the target surface is
 
circular motion, the electron motion path is very long, constantly in the process of movement of the impact
 
ionization out large amounts of argon ion bombardment of target, after many times of collision of the
 
electron energy gradually reduce, cast off the yoke of the magnetic field lines, away from the target
 
material, the final deposition on the substrate.